Author(s)

Zhuohao Sun ¹, Wei Chen ¹, Ping Zhu ¹, Yu Tian ¹, Yucheng Ma ¹, Huaqiang Li ², Jing Chen ³, Jing Xu ³, Xingwu Chen ³

Affiliation(s)

¹ College of Mechanical and Electrical Engineering, Shanxi University of Science & Technology, Xi'an, Shanxi, 710021, China
² State Key Laboratory of Electrical Insulation and Power Equipment, Xi'an Jiaotong University, Xi'an, Shaanxi, 710049, China
³ Far East Cable Co., Ltd., Yixing, Jiangsu, 214200, China

Corresponding Author

Wei Chen

ABSTRACT

The objective of this study is to determine the correlation between the mechanical and electrical characteristics of copper wire subjected to diverse annealing parameters and to characterize its microstructure. The findings reveal that annealing treatment exerts a considerable influence on the properties of copper wire. The strength of copper wire drops significantly upon annealing, while the conductivity rises. After annealing, the grains within the copper wire enlarge and the grain boundary transitions from a non-equilibrium state to an equilibrium one. Additionally, through the quantitative analysis of the relationship among microstructure, strength, and conductivity, it is discovered that the increase in grain size will diminish the strength of copper wire but enhance the conductivity. Overall, the copper wire possesses favorable strength and conductivity after annealing at 180℃ for 30 minutes.

KEYWORDS

Annealing, microstructure, mechanical properties, electrical properties

CITE THIS PAPER

Zhuohao Sun, Wei Chen, Ping Zhu, Yu Tian, Yucheng Ma, Huaqiang Li, Jing Chen, Jing Xu, Xingwu Chen, Study on microstructure regulation and strengthening mechanism of high performance copper cable. Journal of Materials, Processing and Design (2024) Vol. 8: 19-31. DOI: http://dx.doi.org/10.23977/jmpd.2024.080203.

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