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  4. Vol 9, Issue 3, 2024

Research progress of microchannel single-phase flow enhanced heat transfer technology

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DOI: 10.23977/jeis.2024.090314 | Downloads: 16 | Views: 460

Author(s)

Chenxi Yan 1, Zhiming Zhao 1, Qi Liu 1, Xiangjun Jiang 2

Affiliation(s)

1 Collage of Mechanical and Electrical Engineering, Shaanxi University of Science & Technology, Xi'an, Shaanxi, China
2 Collage of Mechanical and Electrical Engineering, Xidian University, Xi'an, Shaanxi, China

Corresponding Author

Xiangjun Jiang

ABSTRACT

With the miniaturization and high degree of integration of electronic devices, the heat generated inside them is difficult to be discharged in a timely manner, resulting in high temperature, performance degradation and even damage to the devices. The microchannel heat sink is characterized by its compact structure and large heat transfer coefficient, which makes it the most suitable device for heat dissipation of electronic devices, but there is still the problem of insufficient heat transfer capacity in the face of future heat dissipation of electronic devices with high heat flow density. This paper firstly gives a brief introduction to the microchannel heat transfer technology, and then summarizes the effects of changes in the geometry and cross-section shape of the microchannel on the heat transfer characteristics and pressure drop, and sums up the influence of the geometric parameters of the law, and also analyzes the effects of variable cross-section channels on the performance. Finally, summarizes the research progress of the bionic-based topology design, and points out that the current research on bionic microchannel structure is still in the stage of model simplification, and the topology design of microchannels described in the paper can all achieve the purpose of enhanced heat transfer. The results show that rectangular channels are easier to obtain and have better performance in practical applications, and the spiderweb-like structure has the best overall performance in topology design. Based on the limitations of the existing research on microchannels, this paper proposes a research direction to change the geometry of the bionic structure, which will provide a reference for the future heat dissipation problems of electronic devices with high heat flow density.

KEYWORDS

Electronic devices; microchannels; heat transfer; topological structure; optimal design

CITE THIS PAPER

Chenxi Yan, Zhiming Zhao, Qi Liu, Xiangjun Jiang, Research progress of microchannel single-phase flow enhanced heat transfer technology. Journal of Electronics and Information Science (2024) Vol. 9: 91-104. DOI: http://dx.doi.org/10.23977/10.23977/jeis.2024.090314.

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