Author(s)

Lian-Tuu Yeh ¹

Affiliation(s)

¹ ASME Fellow, Dallas, Texas

Corresponding Author

Lian-Tuu Yeh

ABSTRACT

The understanding of the effect of the empty slots in the card cage on the thermal analysis and the tests is extremely important. The detailed full scale thermal model of the rack is often too large to be for the practical applications. Similarly, the fillers which are often referred to as the dummy boards are frequently required during the system thermal tests to insure the proper flow distribution to all slots (or boards). The purpose of this study is to examine the effect of filler on the component temperatures of the target board under active (forced convection) and passive (natural convection) cooling. The results indicated that no noticeable difference in the component temperatures between the cases of the fully loaded and partially filled card cages under the forced air cooling with the fans. However, the cases with the partially filled card cage significantly reduce the component temperatures of the heated boards as compared with the fully loaded card cage for natural convection cooling. Therefore, the thermal simulations and/or tests for the passive cooling should be conducted under the actual operation conditions with the full power on all boards in the card cage.

KEYWORDS

Surrounding Boards Effects, Component Temperatures, Telecom Rack, Active or Passive Cooling.

CITE THIS PAPER

Lian-Tuu, Y.. Surrounding Boards Effects on Component Temperatures of Target Board in Telecom Rack with Active or Passive Cooling. Journal of Electronics and Information Science (2018) 3: 1-8.

REFERENCES

[1] Garimella, S. V., Yeh, L. T., and Persoons, T., “Thermal Management Challenges in Telecommunication Systems and Data Centers”, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 2, No. 8,2012
[2] Garimella, S. V., Persoons, T., Weibe, J, and Yeh, L. T., “Technological Drivers in Data Center and Telecom Systems: Multiscale Thermal, Electrical, and Energy Mangement”, Applied Energy, Vol. 107, July 2013
[3] Yeh, L. T., “Thermal Management/Roadmap and Energy Effiicency for Telecommunications Equipment”, Journal of Computational Intelligence and Electronics Systems, Vol 4, 2015
[4] Yeh, L. T., “Thermal Management for Energy Efficient Next Generation Telecommunications Equipment”, Journal of Electronics and Information Sciences, 2, 2017
[5] Yeh, L. T, and Chu, R. C, Thermal Management of Telecommunications Equipment, ASME Press, 2013
[6] Yeh, L. T, and Chu, R. C, Thermal Management of Microelectronics Equipment, ASME Press, 2002
[7] Yeh, L. T, Thermal Management of Microelectronics Equipment (2nd Edition), ASME Press, 2016 

Sponsors, Associates, and Links

---

• Information Systems and Signal Processing Journal
  
  
• Intelligent Robots and Systems
  
  
• Journal of Image, Video and Signals
  
  
• Transactions on Real-Time and Embedded Systems
  
  
• Journal of Electromagnetic Interference and Compatibility
  
  
• Acoustics, Speech and Signal Processing
  
  
• Journal of Power Electronics, Machines and Drives
  
  
• Journal of Electro Optics and Lasers
  
  
• Journal of Integrated Circuits Design and Test
  
  
• Journal of Ultrasonics
  
  
• Antennas and Propagation
  
  
• Optical Communications
  
  
• Solid-State Circuits and Systems-on-a-Chip
  
  
• Field-Programmable Gate Arrays
  
  
• Vehicular Electronics and Safety
  
  
• Optical Fiber Sensor and Communication
  
  
• Journal of Low Power Electronics and Design
  
  
• Infrared and Millimeter Wave
  
  
• Detection Technology and Automation Equipment
  
  
• Journal of Radio and Wireless
  
  
• Journal of Microwave and Terahertz Engineering
  
  
• Journal of Communication, Control and Computing
  
  
• International Journal of Surveying and Mapping
  
  
• Information Retrieval, Systems and Services
  
  
• Journal of Biometrics, Identity and Security
  
  
• Journal of Avionics, Radar and Sonar