Author(s)

Lian-Tuu Yeh ¹

Affiliation(s)

¹ Ph D & PE, ASME Fellow, Dallas, Texas, USA

Corresponding Author

Lian-Tuu Yeh

ABSTRACT

The electronic equipment is often required to operate at various orientations in the real world applications. This is especially critical to the tower or pole or roof top mounted electronics under natural convection. However, it appears that no study has ever been made to examine the effects of orientations of the heat sink over full 90 degrees range from the vertical to the horizontal positions. Therefore, the present study is focusing at the analysis of natural convection heat transfer over the wide range of heat sink orientations to fulfill the needs for the industry.

KEYWORDS

System orientations, Natural convection, Heat transfer, Finned heat sinks

CITE THIS PAPER

Lian-Tuu Yeh, Effects of System Orientations on Natural Convection Heat Transfer from Finned Heat Sinks. Journal of Electronics and Information Science (2022) Vol. 7: 78-88. DOI: http://dx.doi.org/10.23977/jeis.2022.070114.

REFERENCES

[1] Starner, K.E., and McManus, H. N, “An Experimental Investigation of Free Convection Heat Transfer from Rectangular Fin Arrays”, J Heat Transfer 85, 1963
[2] Welling, J.R. and Wooldridge, C. R., “Free Convection Heat Transfer Coefficients from Rectangular Vertical Fins”, J Heat Transfer 87, 1965
[3] Izume, K, and Nakamura, H, “Heat Transfer by Convection on Heated surface with Parallel Fins”, Jap. Soc. Mech. Eng., 34, 1969
[4] Van De Pol, D. W., and Tierney, J.K., “Free Convection Nusselt Number for Vertical U-Shaped Channels”, J Heat Transfer, 95, 1973
[5] Yeh, L.T., Yeh, Joseph and Chung, B.T. F., “Natural Convection from Finned Heat Sinks”, IPack2007-33036, Vancouver, BC, Canada, July 8-12, 2007
[6] Yeh, L. T., Thermal Management of Microelectronic Equipment, 2nd Edition, ASME Press, 2016  

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