Author(s)

Lian-Tuu Yeh ¹

Affiliation(s)

¹ Ph D & PE, ASME Fellow, Dallas, Texas, USA

Corresponding Author

Lian-Tuu Yeh

ABSTRACT

The electronic equipment is often required to operate at various ambient temperatures in the real world conditions, especially for an outdoor system. A cfd analysis is performed to study the effects of the ambient temperatures for the finned heat sink on the heat transfer coefficient under the natural convection conditions. Four different ambient temperatures, 100, 120, 140 and 160 ºF are considered for the continuous fin, staggered fin and in-line fin heat sinks. The overall heat transfer coefficient of individual finned heat sinks is determined to facilitate the thermal analysis and design of the equipment.

KEYWORDS

Ambient Temperatures, Natural Convection Heat Transfer, Finned Heat Sinks

CITE THIS PAPER

Lian-Tuu Yeh. Effects of Ambient Temperatures on Natural Convection Heat Transfer from Finned Heat Sinks. Journal of Electronics and Information Science (2020) 5: 34-40. DOI: http://dx.doi.org/10.23977/jeis.2020.51007.

REFERENCES

[1] Starner, K.E., and McManus, H. N, “An Experimental Investigation of Free Convection Heat Transfer from Rectangular Fin Arrays”, J Heat Transfer 85, 1963
[2] Welling, J.R. and Wooldridge, C. R., “Free Convection Heat Transfer Coefficients from Rectangular Vertical Fins”, J Heat Transfer 87, 1965
[3] Izume, K, and Nakamura, H, “Heat Transfer by Convection on Heated surface with Parallel Fins”, Jap. Soc. Mech. Eng., 34, 1969
[4] Van De Pol, D. W., and Tierney, J.K., “Free Convection Nusselt Number for Vertical U-Shaped Channels”, J Heat Transfer, 95, 1973
[5] Yeh, L.T., Yeh, Joseph and Chung, B.T. F., “Natural Convection from Finned Heat Sinks”, IPack2007-33036, Vancouver, BC, Canada, July 8-12, 2007
[6] Yeh, L.T., “Natural Convection from Finned Heat Sinks with/without Cover/Shroud”, 19th International Symposium on Transport Phenomena, Reykjavik, Iceland, August 17th – 21st, 2008
[7] Yeh, L. T., and Chu, R., C, Thermal Management of Microelectronic Equipment, ASME Press, 2002
[8] Yeh, L. T., and Chu, R., C, Thermal Management of Telecommunications Equipment, ASME Press, 2013
[9] Yeh, L. T., Thermal Management of Microelectronic Equipment, 2nd Edition, ASME Press, 2017

Sponsors, Associates, and Links

---

• Information Systems and Signal Processing Journal
  
  
• Intelligent Robots and Systems
  
  
• Journal of Image, Video and Signals
  
  
• Transactions on Real-Time and Embedded Systems
  
  
• Journal of Electromagnetic Interference and Compatibility
  
  
• Acoustics, Speech and Signal Processing
  
  
• Journal of Power Electronics, Machines and Drives
  
  
• Journal of Electro Optics and Lasers
  
  
• Journal of Integrated Circuits Design and Test
  
  
• Journal of Ultrasonics
  
  
• Antennas and Propagation
  
  
• Optical Communications
  
  
• Solid-State Circuits and Systems-on-a-Chip
  
  
• Field-Programmable Gate Arrays
  
  
• Vehicular Electronics and Safety
  
  
• Optical Fiber Sensor and Communication
  
  
• Journal of Low Power Electronics and Design
  
  
• Infrared and Millimeter Wave
  
  
• Detection Technology and Automation Equipment
  
  
• Journal of Radio and Wireless
  
  
• Journal of Microwave and Terahertz Engineering
  
  
• Journal of Communication, Control and Computing
  
  
• International Journal of Surveying and Mapping
  
  
• Information Retrieval, Systems and Services
  
  
• Journal of Biometrics, Identity and Security
  
  
• Journal of Avionics, Radar and Sonar