Author(s)

Lian-Tuu Yeh ¹

Affiliation(s)

¹ ASME Fellow, Thermal Consultant Dallas, Texas, USA

Corresponding Author

Lian-Tuu Yeh

ABSTRACT

For the tower or poled or even roof top mounted electronics, the heat sink weight is extremely important. This study describes the analysis and development of the light weight plain fin heat sink for cooling of electronics, especially for those outdoor wireless systems. A CFD analysis is performed to investigate the thermal performance of this finned heat sink at the vertical and horizontal positions under the passive cooling scheme, i.e. combined natural convection and radiation heat transfer. In addition, unlike most of previous work which is limited to either a uniform heating or uniform temperature at the base of the heat sink, the present investigation considers discrete heat sources with various power densities (heat loads) from electronics in contact with a section of the heat sink base. It should also be noted that all discussion, including the design, analysis and results can be applied to both the indoor and outdoor equipment. However, for any outdoor equipment, one must include the solar heating to the system into the design and analysis. It is found that the solar heating adds about 4 ºC to all parts of the system.

KEYWORDS

Electronics, Finned heat sink, Light-weight, Natural Convection, Outdoor, Telecommunications

CITE THIS PAPER

Lian-Tuu Yeh. Innovative Design of Light-Weight Finned Heat Sinks for Air Cooling of Electronics by Natural Convection. Journal of Electronics and Information Science (2020) 5: 53-62. DOI: http://dx.doi.org/10.23977/aetp.2020.41010.

REFERENCES

[1] Starner, K.E., and McManus, H. N, “An Experimental Investigation of Free Convection Heat Transfer from Rectangular Fin Arrays”, J Heat Transfer 85, 1963
[2] Welling, J.R. and Wooldridge, C. R., “Free Convection Heat Transfer Coefficients from Rectangular Vertical Fins”, J Heat Transfer 87, 1965
[3] Izume, K, and Nakamura, H, “Heat Transfer by Convection on Heated surface with Parallel Fins”, Jap. Soc. Mech. Eng., 34, 1969
[4] Van De Pol, D. W., and Tierney, J.K., “Free Convection Nusselt Number for Vertical U-Shaped Channels”, J Heat Transfer, 95, 1973
[5] Yeh, L.T., Yeh, Joseph and Chung, B.T. F., “Natural Convection from Finned Heat Sinks”, IPack2007-33036, Vancouver, BC, Canada, July 8-12, 2007
[6] Yeh, L.T., “Natural Convection from Finned Heat Sinks with/without Cover/Shroud”, 19th International Symposium on Transport Phenomena, Reykjavik, Iceland, August 17th – 21st, 2008
[7] Yeh, L.T. and Chu , R. C., Thermal Management of Microelectronic Equipment, ASME Press, 2002
[8] Yeh, L.T. and Chu , R. C., Thermal Management of Telecommunications Equipment, ASME Press, 2013
[9] Yeh, L.T., Thermal Management of Microelectronic Equipment, 2nd Edition, ASME Press, 2017

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