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Thermal Management Roadmap for Energy Efficient Next Generation Telecommunications Equipment

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DOI: 10.23977/jeis.2017.21001 | Downloads: 64 | Views: 4547

Author(s)

Lian-Tuu Yeh 1

Affiliation(s)

1 Thermal Consultant, Dallas, Texas

Corresponding Author

Lian-Tuu Yeh

ABSTRACT

The network traffic in telecommunication industry has grown very rapidly every year since its inception. As projected, the network traffic demand will reach tens or hundreds of Tb/s in a couple of years. With the extrapolation from current equipment, future nodes would consume and dissipate up to 100’s of kilowatts of power.  In response to the projected growth, new design and architecture are needed in order to face the power-density challenges in the next generation telecommunication networks. There are two aspects of these issues. One is the network architecture and another is telecommunication equipment design. The thermal management of latter case is the focus of this paper.

KEYWORDS

Electronic Cooling, thermal management, telecommunication systems, liquid cooling, energy efficiency, alternative energy

CITE THIS PAPER

Lian-Tuu, Y. (2017) Thermal Management Roadmap for Energy Efficient Next Generation Telecommunications Equipment. Journal of Electronics and Information Science (2017) 2: 1-20.

REFERENCES

[1] Vukovic, A, “Power Density Challenges of Next Generation Telecommunication Networks”, ElectronicsCooling, Vol. 9, No. 1, February, 2003
[2] Kenneth G Brill, “2000-2010 Product Heat Density Trends Chart”, White Paper, The Uptime Institute, 2006
[3] Yeh, L.T.,“Thermal Management and Energy Efficiency of Telecommunication Equipment”, nWorkshop on Thermal Management in Telecommunication Systems and Data Centers, Santa Clara, CA, April 25-26, 2012
[4] Ellsworth, M.J., Jr., Campbell, L.A., Simons, R.E., Iyengar, M.K., Schmidt, R.R., Chu, R.C.,The Evolution of Water Cooling for IBM Large Server Systems : Back to Future:, Itherm, 2008  
[5] Tuckerman, D. B and Pease, F.F., “High Performance Heat Sinking for VLSI”, IEEE Electron Devices Letter, EDL-2, 1981  
[6] Tuckerman, D. B., Heat Transfer Microstructures for Integrated Circuits”, Doctoral Thesis, Stanford University, 1984  Colgan, E.V, Bezama, R.J., 
[7] Gaynes, M., and Marston, K.C.,“A Practical Implementation of Silicon Microchannel Coolers”, Electronics Cooling, Volume 13, Number 4, 2007
[8] Lee. Tom, “Simulation, Characterization and Interconnect, Manufacturing Technologies in electronics Packaging Thermal Design,”, nWorkshop on Thermal Management in Telecommunication Systems and Data Centers, Santa Clara, CA, April 25-26, 2012
[9] Alfieri, F., Tiwari, M. K., Zinovik, I., Poulikakos, D., Brunschwiler, T., and Michel, B., “3D Integrated Water Cooling of A Composite Multilayer Stack of Chips”., Proceedings of 14th International Heat Transfer Conference, Washington, DC., USA, August 8-13, 2010.
[10] Jei Wei, “Hybrid Cooling for Fujitsu Large Computer Systems”, 2010 IEEE SPJW, Kyoto, Japan, 2010 
[11] Wrunschwiler, T., Meijer, G. I., Paredes, S., Escher, W., and Michel, B., ”Direct Waste Heat Utilization from Liquid-Cooled Supercomputer”, Proceedings of the 14th International Heat Transfer Conference, Washington, DC, August 8-13, 2010
[12] Bahadur, V., Hodes, M., Lyons, A., Krishnan, S., and Garimella, S.V., “Enhanced Cooling in a Sealed Cabinet using an Evaporating-Condensing Dielectric Mist”, Proceedings of ITHERM, Orlando, FL., 2008
[13] Glover, G., “The Next Generation Router System Cooling”, MS Thesis, California Polytechnic State University, 2009  
[14] Knight, A.F., “Choice of Fluids for Cooling Electronic Equipment,” Electro-Technology, June, 1963.   
[15] Kelly, D.J., “Resistance of Materials to Hydraulic Fluids,” Machine Design, January, 21, 1972.
[16] Schmidt,R. R., “Thermal Management Applied to Data Centers with focus on Energy Efficiency, workshop on Thermal Management in Telecommunication Systems and Data Centers, Richardson, TX, October 25-26, 2010
[17] Brill, K. G., “Data Center Energy Efficiency and Productivity”, White Paper, The Uptime Institute, 2007
[18] Graff, C., “Verizon’s Thermal Management Program for Network Equipment Design”, 2009 
[19] Fisher, T, “Waste Heat Recovery from Electronics”, CTRC Project review meeting, Purdue University, 2010
[20] Parsons, M.J., and Josefik, N.M., “Accelerating Production Readiness using Lean Product Development”, Proceedings of ASME 2009 7th International Fuel Cell Science, Engineering and Technology Conference, Newport Beach, CA, June 8-10, 2009
[21] Garimella, S. V., Yeh, L. T., and Persoons, T., “Thermal Management Challenges in Telecommunication Systems and Data Centers”, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 2, No. 8,2012
[22] Garimella, S. V., Persoons, T., Weibe, J, and Yeh, L. T., “Technological Drivers in Data Center and Telecom Systems : Multiscale Thermal, Electrical, and Energy Mangement”, Applied Energy, Vol. 107, July 2013
[23] Yeh, L.T. and Chu, R. C., Thermal Management of Telecommunications Equipment, ASME Press, 2013
[24] Yeh, L.T. and Chu, R. C., Thermal Management of Microelectronic Equipment, ASME Press, 2002

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