Thermal Management Roadmap for Energy Efficient Next Generation Telecommunications Equipment
DOI: 10.23977/jeis.2017.21001 | Downloads: 64 | Views: 4547
Lian-Tuu Yeh 1
1 Thermal Consultant, Dallas, Texas
Corresponding AuthorLian-Tuu Yeh
The network traffic in telecommunication industry has grown very rapidly every year since its inception. As projected, the network traffic demand will reach tens or hundreds of Tb/s in a couple of years. With the extrapolation from current equipment, future nodes would consume and dissipate up to 100’s of kilowatts of power. In response to the projected growth, new design and architecture are needed in order to face the power-density challenges in the next generation telecommunication networks. There are two aspects of these issues. One is the network architecture and another is telecommunication equipment design. The thermal management of latter case is the focus of this paper.
KEYWORDSElectronic Cooling, thermal management, telecommunication systems, liquid cooling, energy efficiency, alternative energy
CITE THIS PAPER
Lian-Tuu, Y. (2017) Thermal Management Roadmap for Energy Efficient Next Generation Telecommunications Equipment. Journal of Electronics and Information Science (2017) 2: 1-20.
 Vukovic, A, “Power Density Challenges of Next Generation Telecommunication Networks”, ElectronicsCooling, Vol. 9, No. 1, February, 2003
 Kenneth G Brill, “2000-2010 Product Heat Density Trends Chart”, White Paper, The Uptime Institute, 2006
 Yeh, L.T.,“Thermal Management and Energy Efficiency of Telecommunication Equipment”, nWorkshop on Thermal Management in Telecommunication Systems and Data Centers, Santa Clara, CA, April 25-26, 2012
 Ellsworth, M.J., Jr., Campbell, L.A., Simons, R.E., Iyengar, M.K., Schmidt, R.R., Chu, R.C.,The Evolution of Water Cooling for IBM Large Server Systems : Back to Future:, Itherm, 2008
 Tuckerman, D. B and Pease, F.F., “High Performance Heat Sinking for VLSI”, IEEE Electron Devices Letter, EDL-2, 1981
 Tuckerman, D. B., Heat Transfer Microstructures for Integrated Circuits”, Doctoral Thesis, Stanford University, 1984 Colgan, E.V, Bezama, R.J.,
 Gaynes, M., and Marston, K.C.,“A Practical Implementation of Silicon Microchannel Coolers”, Electronics Cooling, Volume 13, Number 4, 2007
 Lee. Tom, “Simulation, Characterization and Interconnect, Manufacturing Technologies in electronics Packaging Thermal Design,”, nWorkshop on Thermal Management in Telecommunication Systems and Data Centers, Santa Clara, CA, April 25-26, 2012
 Alfieri, F., Tiwari, M. K., Zinovik, I., Poulikakos, D., Brunschwiler, T., and Michel, B., “3D Integrated Water Cooling of A Composite Multilayer Stack of Chips”., Proceedings of 14th International Heat Transfer Conference, Washington, DC., USA, August 8-13, 2010.
 Jei Wei, “Hybrid Cooling for Fujitsu Large Computer Systems”, 2010 IEEE SPJW, Kyoto, Japan, 2010
 Wrunschwiler, T., Meijer, G. I., Paredes, S., Escher, W., and Michel, B., ”Direct Waste Heat Utilization from Liquid-Cooled Supercomputer”, Proceedings of the 14th International Heat Transfer Conference, Washington, DC, August 8-13, 2010
 Bahadur, V., Hodes, M., Lyons, A., Krishnan, S., and Garimella, S.V., “Enhanced Cooling in a Sealed Cabinet using an Evaporating-Condensing Dielectric Mist”, Proceedings of ITHERM, Orlando, FL., 2008
 Glover, G., “The Next Generation Router System Cooling”, MS Thesis, California Polytechnic State University, 2009
 Knight, A.F., “Choice of Fluids for Cooling Electronic Equipment,” Electro-Technology, June, 1963.
 Kelly, D.J., “Resistance of Materials to Hydraulic Fluids,” Machine Design, January, 21, 1972.
 Schmidt,R. R., “Thermal Management Applied to Data Centers with focus on Energy Efficiency, workshop on Thermal Management in Telecommunication Systems and Data Centers, Richardson, TX, October 25-26, 2010
 Brill, K. G., “Data Center Energy Efficiency and Productivity”, White Paper, The Uptime Institute, 2007
 Graff, C., “Verizon’s Thermal Management Program for Network Equipment Design”, 2009
 Fisher, T, “Waste Heat Recovery from Electronics”, CTRC Project review meeting, Purdue University, 2010
 Parsons, M.J., and Josefik, N.M., “Accelerating Production Readiness using Lean Product Development”, Proceedings of ASME 2009 7th International Fuel Cell Science, Engineering and Technology Conference, Newport Beach, CA, June 8-10, 2009
 Garimella, S. V., Yeh, L. T., and Persoons, T., “Thermal Management Challenges in Telecommunication Systems and Data Centers”, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 2, No. 8,2012
 Garimella, S. V., Persoons, T., Weibe, J, and Yeh, L. T., “Technological Drivers in Data Center and Telecom Systems : Multiscale Thermal, Electrical, and Energy Mangement”, Applied Energy, Vol. 107, July 2013
 Yeh, L.T. and Chu, R. C., Thermal Management of Telecommunications Equipment, ASME Press, 2013
 Yeh, L.T. and Chu, R. C., Thermal Management of Microelectronic Equipment, ASME Press, 2002