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Analysis and Selection of insulating material based on 3D Printing PCB board

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DOI: 10.23977/icamcs.2018.068


Bai Lei, Sun Changjian, Zhang Zhiyi

Corresponding Author

Zhang Zhiyi


The traditional PCB plate makes process and adopts "reduction". The combination of art and technology has created a new "added material manufacturing" theory. There is important research value. The paper takes electrons, potting adhesive as insulation material of PCB circuit board. Printing tests for various types of potting compound which is carried out. The result of comparative data is obtained. Finally on the photo paper, the electronic circuit seal layer is completed as well as insulation performance test is conducted.


Three dimensional printing, PCB manufacturing, insulation layer, electronic encapsulation

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