Author(s)

Chenkan Yan, Dun Wang, Kaihong Zhang, Weikun Xie, Yongkang Wan, Guangyao Chen, and HuiBin Zhang

Corresponding Author

Dun Wang

ABSTRACT

In this paper, the DELPHI thermal transfer route was studied by simulation based on a kind of self-designed ceramic packaging chip. The influence of environment temperature on junction temperature and thermal resistance was studied by infra-optical test method and electrical test method. The results showed that, the junction temperature increased from 28.5℃ to 134.5℃ and the thermal resistance increased from 1.850℃/W to 2.782℃/W while the environment temperature increased from 25℃ to 125℃. The thermal resistance increased with the increases of environment temperature and the junction temperature. Furthermore, the high temperature zone existed near the local power consumption unit, leading to the failure of the device. In this study, the environment temperature on the distribution of internal temperature field of the chip was systematically analyzed. The infra-optical method was compared with the electrical method and the reason for the tolerance between the simulation and test is investigated. This study lays the foundations for the thermal reliability and failure analysis of ceramic chips and could be reference for thermal properties study in practical work.

KEYWORDS

IC design, verification, thermal design, ceramic packaging chips