Author(s)

Xiongkai Dang ¹, Lijun Yang ¹, Shubin Zhang ¹, Baolong Su ¹, Ziqi Liu ¹

Affiliation(s)

¹ School of Mechanical and Electrical Engineering, Shaanxi University of Science and Technology, Xi'an, China

Corresponding Author

Xiongkai Dang

ABSTRACT

To address the issues of non-adjustable gold wire bonding height difference, low bonding reliability, and difficulty in chip replacement associated with the planar packaging of MEMS pressure chips in conventional pressure scanning valves, this paper proposes a detachable core-body package structure. By adjusting the PCB thickness to vary the vertical distance between bonding points, the stress and deformation during gold wire bonding are optimized. A circular washer is used as an intermediate support for the pressure chip, which is then secured onto the core-body structural component via a core screw, enabling rapid replacement of individual pressure chips. Using finite element analysis, the equivalent stress and deformation of the gold wire under thermal cycling loads (−40 °C to 125 °C) were evaluated for different bonding point height difference. Results show that the maximum equivalent stress occurs at the neck region of the first bond and increases significantly with increasing vertical separation between the two bonds. The maximum deformation of the bonded wire appears at the midpoint along the wire arc length, and the deformation varies over time. When H12 decreases from 0.6 mm to 0 mm, the peak equivalent stress reduces by 42%, and the wire deformation at high temperature decreases by 33.8%. Life prediction based on the Coffin-Manson model indicates a fatigue cycle life of approximately 1404 cycles under zero height difference bonding, providing theoretical support for highly reliable packaging design in pressure scanning valves. 

KEYWORDS

MEMS pressure chip; Gold wire bonding; Detachable core package; Finite element simulation; Reliability analysis

CITE THIS PAPER

Xiongkai Dang, Lijun Yang, Shubin Zhang, Baolong Su, Ziqi Liu. Simulation Study on the Gold Wire Bonding Reliability of MEMS Pressure Chips Based on a Detachable Core Package Structure. Journal of Electrotechnology, Electrical Engineering and Management (2026). Vol. 9, No.1, 120-128. DOI: http://dx.doi.org/10.23977/jeeem.2026.090115.

REFERENCES

[1] Wang Huan, Zeng Qinghua. Review of Research Progress on Pressure Scanning Valve Pressure Measurement Systems [J]. Aerospace Metrology Technology, 2021, 41(6): 76-81.
[2] Jiang Yuqi, Liu Shuli, Xia Chenhui, et al. Parametric Modeling and Simulation of Silicon-Aluminum Wire Bonding [J]. Electronics & Packaging, 2022, 22(9): 31-36. DOI: 10.16257/j.cnki.1681-1070.2022.0910.
[3] KUMAR S,RATHORE P K,RANGABABU P. Implementation of operational amplifier for the designing of novel piezoresistive pressure sensor [C]//2018 2nd International Conference on Smart Sensors and Application(ICSSA),2018:126 -129.
[4] Ji Liuxin. Design and Application Research of Miniaturized High-Precision Multi-Channel Pressure Scanning Valve [D]. Jiangnan University, 2024.
[5] Sun Tingxiao, Wu Junjie, Wang Xiwen, et al. Prediction of Bond Wire Fatigue Life and Reliability Analysis for SiP Modules [J]. Research and Progress in Solid State Electronics, 2022, 42(6): 479-483+504. DOI: 10.19623/j.cnki.rpsse.2022.06.001.
[6] Chang Liang, Sun Bin, Xu Pinli, et al. Analysis of the Main Factors Leading to Failure of Gold Wire Bonding [J]. Specialized Equipment for Electronics Industry, 2021, 50(2): 23-28.
[7] Chidambaram N V. A numerical and experimental study of temperature cycle wire bond failure[C]. Electronic Components and Technology Conference, 1991. Proceedings.  IEEE Xplore, 1991:877-882.

Sponsors, Associates, and Links

---

• Power Systems Computation
  
  
• Internet of Things (IoT) and Engineering Applications
  
  
• Computing, Performance and Communication Systems
  
  
• Journal of Artificial Intelligence Practice
  
  
• Advances in Computer, Signals and Systems
  
  
• Journal of Network Computing and Applications
  
  
• Journal of Web Systems and Applications
  
  
• Journal of Wireless Sensors and Sensor Networks
  
  
• Journal of Image Processing Theory and Applications
  
  
• Mobile Computing and Networking
  
  
• Vehicle Power and Propulsion
  
  
• Frontiers in Computer Vision and Pattern Recognition
  
  
• Knowledge Discovery and Data Mining Letters
  
  
• Big Data Analysis and Cloud Computing
  
  
• Electrical Insulation and Dielectrics
  
  
• Crypto and Information Security
  
  
• Journal of Neural Information Processing
  
  
• Collaborative and Social Computing
  
  
• International Journal of Network and Communication Technology
  
  
• File and Storage Technologies
  
  
• Frontiers in Genetic and Evolutionary Computation
  
  
• Optical Network Design and Modeling
  
  
• Journal of Virtual Reality and Artificial Intelligence
  
  
• Natural Language Processing and Speech Recognition
  
  
• Journal of High-Voltage
  
  
• Programming Languages and Operating Systems
  
  
• Visual Communications and Image Processing
  
  
• Journal of Systems Analysis and Integration
  
  
• Knowledge Representation and Automated Reasoning
  
  
• Review of Information Display Techniques
  
  
• Data and Knowledge Engineering
  
  
• Journal of Database Systems
  
  
• Journal of Cluster and Grid Computing
  
  
• Cloud and Service-Oriented Computing
  
  
• Journal of Networking, Architecture and Storage
  
  
• Journal of Software Engineering and Metrics
  
  
• Visualization Techniques
  
  
• Journal of Parallel and Distributed Processing
  
  
• Journal of Modeling, Analysis and Simulation
  
  
• Journal of Privacy, Trust and Security
  
  
• Journal of Cognitive Informatics and Cognitive Computing
  
  
• Lecture Notes on Wireless Networks and Communications
  
  
• International Journal of Computer and Communications Security
  
  
• Journal of Multimedia Techniques
  
  
• Automation and Machine Learning
  
  
• Computational Linguistics Letters
  
  
• Journal of Computer Architecture and Design
  
  
• Journal of Ubiquitous and Future Networks