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Journal of Electrotechnology, Electrical Engineering and Management

ISSN 2560-6689(Print)

ISSN 2560-6697(Online)

Simulation Study on the Gold Wire Bonding Reliability of MEMS Pressure Chips Based on a Detachable Core Package Structure

Xiongkai Dang*, Lijun Yang, Shubin Zhang, Baolong Su, Ziqi Liu

Abstract | References | PDF | HTML | Pub. Date: Jul 31, 2026

DOI: 10.23977/jeeem.2026.090115 | Downloads: 5 | Views: 48

Research on Dynamic Health Assessment of Metro Integrated Supervision and Control System Equipment Based on Digital Twin

Yuanchen Liu, Changchun Liu*, Jianmin Xu, Jiaqiang Ji

Abstract | References | PDF | HTML | Pub. Date: Jul 13, 2026

DOI: 10.23977/jeeem.2026.090112 | Downloads: 1 | Views: 173

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